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1. general description the IP4791CZ12 is designed for mobile hdmi transmitter interface protection and it includes level shifting for the ddc, cec, hot plug signal and back drive protection. in addition, all signals are protected by high-level esd diodes. the level shifting function is required to protect the i/os against over voltages when the transmitter operates at a supply voltage lower than the external devices. the IP4791CZ12 contains active buffers to provide the level shifting function, hot plug detect input and the cec pull up current source. the esd diodes provide protection from esd voltages up to 8 kv, according to the iec 61000-4-2, level 4 standard. 2. features and bene?ts n hdmi 1.3 compliant n pb-free and rohs compliant (dark green compliant) n robust esd protection without degradation after multiple esd strikes n low leakage even after several hundred esd discharges n bidirectional level shifting buffer provided for ddc clock and data channels n back drive protection n power management n cec pull-up current source and level shifting buffer n hot plug detect module with pull down resistor n matched 0.4 mm trace spacing for hdmi type c connector 3. applications the IP4791CZ12 can be used with a range of hdmi transmitter devices including: n personal computer n notebook n mobile phone n dv camcorder n digital still camera n mp3 player IP4791CZ12 hdmi esd protection, level shifter and back drive protection rev. 01 1 april 2010 objective data sheet
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 2 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 4. ordering information 5. functional diagram table 1. ordering information type number package name description version IP4791CZ12 hxson12 plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 2.1 2.5 0.5 mm sot1156-1 fig 1. functional diagram 001aak735 1.85 k w 3.6 k w esd rail ddc data (connector) ddc data (system) 5.0 v 5.0 v enable 1.8 v 10 k w 26 k w esd rail cec out (connector) cec in (system) enable 1.8 v 1.85 k w 3.6 k w 100 k w esd rail ddc clock (connector) ddc clock (system) 5.0 v 5.0 v hdmi_5v0_out hdmi_5v0_in enable 1.8 v esd rail active enable 1.8 v 100 k w 5.0 v 100 k w esd rail esd rail hot plug in hot plug out 1.8 v 3v3
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 3 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin con?guration (transparent top view) 001aak734 12 cec_out cec_in 1 11 ddc_clk_out ddc_clk_in 2 10 ddc_dat_out ddc_dat_in 3 9 active v cc_low 4 8 hdmi_5v0_out hdmi_5v0_in 5 7 hotplug_det_in hotplug_det_out 6 gnd table 2. pin description symbol pin description cec_in 1 cec system side ddc_clk_in 2 ddc clock system side ddc_dat_in 3 ddc data system side v cc_low 4 supply voltage, low voltage side for level shifting hdmi_5v0_in 5 5 v line from main supply hotplug_det_out 6 hot plug detect system side hotplug_det_in 7 hot plug detect connector side hdmi_5v0_out 8 5 v line to hdmi connector active 9 power saving mode ddc_dat_out 10 ddc data connector side ddc_clk_out 11 ddc clock connector side cec_out 12 cec connector side gnd pad ground
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 4 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 7. limiting values [1] iec 61000-4-2, level 4, contact [2] machine model (mm) according to jesd22-a115-a. [3] human body model (hbm) according to jesd22-a-j114d. [4] including the current through the internal pull-up resistors. table 3. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v esd electrostatic discharge voltage signal pins to ground: at hdmi/dvi connector side [1] - 8 + 8kv all pins - machine model [2] - 200 + 200 v all pins - human body model [3] - 2 + 2kv v cc supply voltage gnd - 0.5 5.5 v v i input voltage gnd - 0.5 5.5 v p tot total power dissipation active = high; ddc operating at 100 khz, 50 % duty cycle; cec operating at 1 khz, 50 % duty cycle. [4] -30mw disable: hdmi cable not connected, pin active = low, ddc bus in idle mode. -1mw t stg storage temperature - 55 +125 c t amb ambient temperature - 40 +85 c
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 5 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 8. characteristics table 4. supplies gnd = 0 v; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit v cc(5v0) supply voltage (5.0 v) 4.5 5.0 5.5 v v cc(1v8) supply voltage (1.8 v) 1.62 1.8 3.63 v table 5. static characteristics v cc(5v0) = 5.0 v; v cc(1v8) = 1.8 v; gnd = 0 v; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit hdmi_5v0_out r dyn dynamic resistance [1] positive transient - 1.0 - w negative transient - 0.90 - w v cl clamping voltage channel clamping positive transient; 8 kv, 100 ns, iec 61000, level 4, contact - 8.0 - v active v ih high-level input voltage [2] 1.2 - - v v il low-level input voltage - - 0.8 v r pd pull-down resistance 60 100 140 k w ddc buffer - connector side (pin 10 and pin 11) [2] v ih high-level input voltage 0.7 v cc(5v0) - 5.5 v v il low-level input voltage - 0.5 - 0.3 v cc(5v0) v v ik input clamping voltage i i = - 18 ma - - - 1.2 v v ol low-level output voltage internal pull-down current - 0.3 0.4 v v oh high-level output voltage v cc(5v0) - 0.02 - v cc(5v0) + 0.02 v c io input/output capacitance v cc(5v0) = 0 v; v cc(1v8) =0v; v bias = 2.5 v; ac input = 3.5 v peak-to-peak; frequency 100 khz [3] - 8 10 pf r pu pull-up resistance 1.70 1.85 2.0 k w ddc buffer - system side (pin 2 and pin 3) [2] v ih high-level input voltage 0.26 v cc(1v8) -- v v il low-level input voltage - - 0.20 v cc(1v8) v v ik input clamping voltage i i = - 18 ma - - - 1.2 v v ol low-level output voltage - - 0.28 v cc(1v8) v v oh high-level output voltage v cc(1v8) - 0.02 - v cc(1v8) + 0.02 v c io input/output capacitance v cc(5v0) = 0 v; v cc(1v8) =0v; v bias = 2.5 v; ac input = 3.5 v peak-to-peak; frequency 100 khz [3] -67pf r pu pull-up resistance 3.2 3.65 4.1 k w
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 6 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications [1] ansi-esdsp5.5.1-2004, esd sensitivity testing tlp component level method 50 tdr. [2] the device is active if the input voltage at pin active is above the high level. [3] this parameter is guaranteed by design. cec_out [2] c io input/output capacitance v cc(5v0) = 0 v; v cc(1v8) =0v; v bias = 2.5 v; ac input = 3.5 v peak-to-peak; frequency 100 khz [3] - 8 10 pf v ih high-level input voltage 2.0 - - v v il low-level input voltage - - 0.80 v v oh high-level output voltage 2.88 3.3 3.63 v v ol low-level output voltage i ol = 1.5 ma - 0.3 0.4 v r pu pull-up resistance 23.4 26.0 28.6 k w cec_in [2] c io input/output capacitance v cc(5v0) = 0 v; v cc(1v8) =0v; v bias = 2.5 v; ac input = 3.5 v peak-to-peak; frequency 100 khz [3] -67pf v ih high-level input voltage 0.26 v cc(1v8) -- v v il low-level input voltage - - 0.20 v cc(1v8) v v oh high-level output voltage v cc(1v8) - 0.02 - v cc(5v0) + 0.02 v v ol low-level output voltage - - 0.28 v cc(1v8) v r pu pull-up resistance 8.5 10.0 11.5 k w hotplug_det_in [2] v ih high-level input voltage 2.0 - - v v il low-level input voltage - - 0.8 v r pd pull-down resistance 60 100 140 k w c i input capacitance v cc(5v0) = 0 v; v cc(1v8) =0v; v bias = 2.5 v; ac input = 3.5 v peak-to-peak; frequency 100 khz [3] - 8 10 pf hotplug_det_out [2] v oh high-level output voltage i ol = 1 ma 0.7 v cc(1v8) -- v v ol low-level output voltage i ol = - 1 ma - 200 300 mv r pd pull-down resistance 60 100 140 k w table 5. static characteristics continued v cc(5v0) = 5.0 v; v cc(1v8) = 1.8 v; gnd = 0 v; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 7 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications [1] all dynamic measurements are done with a 50 pf load. rise times are determined by internal pull-up resistors. table 6. dynamic characteristics v cc(5v0) = 5.0 v; v cc(1v8) = 1.8 v; gnd = 0 v; t amb = 25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit ddc_dat_in, ddc_clk_in, ddc_dat_out, ddc_clk_out t plh low to high propagation delay system side to connector side figure 3 [1] -80-ns t phl high to low propagation delay system side to connector side figure 3 [1] -80-ns t plh low to high propagation delay connector side to system side figure 4 [1] - 100 - ns t phl high to low propagation delay connector side to system side figure 4 [1] -90-ns t tlh low to high transition time connector side figure 5 [1] - 150 - ns t thl high to low transition time connector side figure 5 [1] - 100 - ns t tlh low to high transition time system side figure 6 [1] - 300 - ns t thl high to low transition time system side figure 6 [1] -80-ns
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 8 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 9. ac waveforms 9.1 ddc propagation delay fig 3. propagation delay ddc, ddc system side to ddc connector side fig 4. propagation delay ddc, ddc connector side to ddc system side 001aak736 ddc system side ddc connector side v cc(1v8) 0.5 v cc(5v0) 0.28 v cc(1v8) v ol v ol 0.5 v cc(5v0) t phl t plh 0.5 v cc(1v8) v cc(5v0) 001aak737 ddc system side ddc connector side v cc(1v8) 0.5 v cc(5v0) v ol v ol 0.5 v cc(5v0) t phl t plh 0.5 v cc(1v8) 0.5 v cc(1v8) v cc(5v0)
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 9 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 9.2 ddc transition time fig 5. transition time ddc connector side fig 6. transition time ddc system side 001aak738 ddc system side ddc connector side v ol v cc(5v0) 80 % v cc(5v0) 20 % v cc(5v0) v cc(1v8) v ol t phl t plh 001aak739 ddc system side ddc connector side v cc(1v8) 80 % v cc(1v8) 20 % v cc(1v8) v ol v ol t phl t plh v cc(5v0)
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 10 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 10. application information 10.1 hdmi source the IP4791CZ12 simpli?es the application of a mobile hdmi source. no external components are needed for the application to adapt the hdmi port to the hdmi transmitter. note: the 5 v supply voltage must be in the range 4.8 v to 5.3 v to pass the hdmi compliance test. (1) the tdms lines are 100 w differential impedance transmission lines which pass underneath the chip without being interrupted by it. fig 7. hdmi transmitter application 001aal767 hot plug 1 10 1 9 2 8 (1) (1) 3 7 4 6 d2_p d2_p d2_n d0_p d0_n d1_p d1_n cec_con scl_con sda_con hpd_in +5 v hdmi clk_p clk_n d2_n d0_p d0_n 5 u1 hdmi-d receptacle ip4283cz10 utility 2 tmds_data 2+ 3 tmds_gnd 4 tmds_data 2 - 5 tmds_data 1+ 6 tmds_gnd 7 tmds_data 1 - 8 tmds_data 0+ 9 tmds_gnd 10 tmds_data 0 - 11 tmds_clk+ 12 tmds_gnd 13 tmds_clk - 14 cec 15 ddc/cec gnd 16 scl 17 sda 18 p 5v0 19 gnd 20 gnd connector system j1 10 1 9 2 8 3 7 4 6 d1_p d1_n clk_p clk_n cec_sys scl_sys sda_sys 1v8 5v0_in hpd_out 5 u2 ip4283cz10 1 12 2 11 3 10 4 9 5 8 u3 0 IP4791CZ12 6 7
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 11 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 11. package outline fig 8. package outline sot1156-1 (hxson12) references outline version european projection issue date iec jedec jeita sot1156-1 - - - - - - - - - sot1156-1_po 09-11-20 10-01-21 unit (1) mm max nom min 0.5 0.05 0.00 0.25 0.20 0.15 2.6 2.5 2.4 2.25 2.20 2.15 2.2 2.1 2.0 0.4 2 0.30 0.25 0.20 0.05 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. hxson12: plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 2.1 x 2.5 x 0.5 mm sot1156-1 a 1 a 3 0.127 bdd h ee h 1.15 1.10 1.05 ee 1 k 0.2 lv 0.1 w 0.05 y 0.05 y 1 0 1 2 mm scale x b a terminal 1 index area d e detail x a a 1 a 1 c y c y 1 b terminal 1 index area e 1 e a c b v c w l e h k d h 6 1 7 12
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 12 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 12. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 12.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 12.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 12.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 13 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 12.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 9 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 7 and 8 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 9 . table 7. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 8. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 14 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 13. abbreviations 14. revision history msl: moisture sensitivity level fig 9. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 9. abbreviations acronym description cec consumer electronic control ddc data display channel esd electrostatic discharge hdmi high de?nition multimedia interface rohs restriction of hazardous substances tdms transition minimized differential signalling table 10. revision history document id release date data sheet status change notice supersedes IP4791CZ12_1 20100401 objective data sheet - -
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 15 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers limited warranty and liability information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost pro?ts, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customers third party customer(s) (hereinafter both referred to as application). it is customers sole responsibility to check whether the nxp semiconductors product is suitable and ?t for the application planned. customer has to do all necessary testing for the application in order to avoid a default of the application and the product. nxp semiconductors does not accept any liability in this respect. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of nxp semiconductors products by customer. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. non-automotive quali?ed products unless this data sheet expressly states that this speci?c nxp semiconductors product is automotive quali?ed, the product is not suitable for automotive use. it is neither quali?ed nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive quali?ed products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive speci?cations and standards, customer (a) shall use the product without nxp semiconductors warranty of the product for such automotive applications, use and speci?cations, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors speci?cations such use shall be solely at customers own risk, and (c) customer fully indemni?es nxp semiconductors for any liability, document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
IP4791CZ12_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. objective data sheet rev. 01 1 april 2010 16 of 17 nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications damages or failed product claims resulting from customer design and use of the product for automotive applications beyond nxp semiconductors standard warranty and nxp semiconductors product speci?cations. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com
nxp semiconductors IP4791CZ12 hdmi interface protection for mobile applications ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 1 april 2010 document identifier: IP4791CZ12_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and bene?ts . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 8 9.1 ddc propagation delay . . . . . . . . . . . . . . . . . . 8 9.2 ddc transition time. . . . . . . . . . . . . . . . . . . . . . 9 10 application information. . . . . . . . . . . . . . . . . . 10 10.1 hdmi source. . . . . . . . . . . . . . . . . . . . . . . . . . 10 11 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 12 soldering of smd packages . . . . . . . . . . . . . . 12 12.1 introduction to soldering . . . . . . . . . . . . . . . . . 12 12.2 wave and re?ow soldering . . . . . . . . . . . . . . . 12 12.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12 12.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 contact information. . . . . . . . . . . . . . . . . . . . . 16 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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